 |
| Parameter | Specification |
| Supply Voltage (VCC) | 7 V |
| Input Voltage (VI) | 7 V |
| Operating free-air temperature range | 0°C to +70°C |
| Storage temperature range | –65°C to +150°C |
| Parameter | Condition | Typical | Unit | |
| HC | HCT | |||
| Propagation delay (tPHL) | CL = 15 pF; VCC = 5 V | |||
| CP to Qn | 19 | 21 | ns | |
| CP to TC | 21 | 24 | ns | |
| MR to Qn | 21 | 23 | ns | |
| MR to TC | 21 | 26 | ns | |
| CET to TC | 14 | 14 | ns | |
| propagation delay (tPLH) | ||||
| CP to Qn | 19 | 21 | ns | |
| CP to TC | 21 | 20 | ns | |
| CET to TC | 14 | 7 | ns | |
| maximum clock frequency (fmax) | 61 | 31 | MHz | |
| input capacitance (C1) | 3.5 | 3.5 | pF | |
| power dissipation capacitance per package (CPD) | 3.9 | 34 | pF | |
| Parameter | Specification |
| Supply Voltage (VCC | − 0.5 to + 7.0V |
| Input Voltage (VIN) | −1.5V to VCC + 1.5V |
| Output Voltage (VOUT) | − 0.5 to VCC + 0.5V |
| Clamp Diode Current (IIK, IOK) | ± 20 mA |
| DC Output Current, per pin (IOUT) | ± 35 mA |
| DC VCC or GND Current, per pin (ICC) | ± 70 mA |
| Storage Temperature Range (TSTG) | − 65°C to + 150°C |
| Power Dissipation (PD) (Note 4) | 600 mW |
| S.O. Package only | 500 mW |
| Lead Temperature (TL) (Soldering 10 seconds) | 260°C |
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